Altera does not have a set schedule to introduce lead-free solder bump flip-chip products at this time. Internal solder bumps are exempted from the RoHS Directive until 2010, and Altera is closely monitoring the industry progress with a plan to start qualification in the near future. Home | Products | Support | End Markets | Technology Center | Education & Events | Corporate | Buy On-Line

Altera has been offering and shipping lead-free products since 2002 in production quantities. Please visit our Lead-Free Devices web page for complete details. A: Altera's Lead-Free Product Offering list provides an easy way to check the availability of devices you will need. As long as the device you want is listed on the availability sheet, no additional work is required until your transition date is set.

A31. Yes, but there is the potential for poor alignment and open joints. Since the usual SnPb reflow profile may not exceed the melting point of the BGAs’ lead-free solder balls, the SnPb solder paste melts but the SnAgCu solder balls do not. The lack of ball collapse may cause a lack of contact between the solder paste and the solder ball.

Higher melting point of Lead-free solder may cause physical and thermal damage to components and PCB.

Since there is higher tin content, with higher temperature and presence of more active flux, the erosion of soldering tips occurs faster than regular tin/lead solder.

Reflow soldering: SnAgCu, SnAgCuBi, SnAg, SnAgBi, SnZnBi, SnIn (the bismuth-containing solders are more suitable for low temperature soldering) Wave Soldering: SnAgCu, SnCu, SnCu(Ni 0.1%), SnCuX, where X is the small fraction of elements claimed to increase performance A13. No suitable alternative has yet been identified for this solder which melts at around 302OC.

Soldered surfaces must be free of lead to begin with. This includes the PCB as well as the component. Lead contamination on a lead-free solder joint will significantly reduce the reliability of the joint. All lead-free alloys melt at a higher temperature than traditional tin-lead alloys. The temperature of the soldering iron may need to be increased, and both the components and PCB will need to withstand these higher levels.

Primarily NEMI and IPC in the United States and Soldertec and Smartgroup in Europe. NEMI, which develops technology “roadmaps” for the electronics industry, identified a gap in the manufacturing infrastructure necessary for conversion to lead free in the early 1990’s when the first WEEE draft appeared. Since then NEMI has been instrumental in providing leadership and coordination to facilitate the conversion to lead-free.

Any fuel gas lines installed using copper tube must be brazed using a filler metal containing less than 0.05% P (phosphorus) and a melting temperature greater than 1000 degrees F. The only filler metal (trade and industry standard) that contains less than the 0.05% P would be an AWS BAg type alloy (according to the American Welding Society’s AWS A5.8 specification). In no case should solder or “soft-solder” be used to join copper tube and fittings in fuel gas systems.

Lead wicks are not available in the United States any more. Most people confuse zinc cored wicks with lead these days. L'ocean uses only 100% cotton wicks in our candles, providing for the best possible burn.

Click http://www.freescale.com/files/product/doc/ENV_MSLPPT.pdf to download the Freescale recommendation. Freescale targets a PPT of 260°C with an MSL of 3 or better, however, some products may not be able to meet this target. Freescale provides the PPT and MSL level for each part number via web access or by special request.

A 260?C solder reflow profile can be used for all Pb-free devices please see attached link: Solder Profile

We highly recommend Audio Note silver solder. This is one of the very few solders that has been specifically developed for audio use and is very highly rated.

Solder is a lead/tin mixture that is melted and used to bond two pieces of certain types of metal together.

Require credited solder material vendor to offer samples and related specificaton for perusal. Set the temperature profile of solder bath as per specification. Finally undergo a test on the sampleand review the result.

Make sure you never use solder that says "acid core". Plumbers might use that stuff to solder oxidized metals but it will corrode the $#|+ out of your electronics if used. Avoid that stuff like the plague. Here are three types that are OK to use: Tin 37% Lead" solder is the easiest stuff to use IMO since it melts cleanly at the lowest temperature. Make sure it says "Rosin Core" if it has flux added - most have it. Then if it says "no-clean flux" it's even easier. The Kester brand works for me.

Whatever works for your product. In our view, there is no such as a "good" material or a "bad" material. You just have to find materials that have the right blend of properties for your hardware and your process. We have seen very good results from: Alpha Metals UP-78, Kester 245, Indium SMQ-92J, Multicore X33, although each paste manufacturer has some excellent offerings. It depends on what you are looking for.

If a customer requires that a package type not qualified as lead-free be manufactured and supplied, a request must be submitted to the Maxim Integrated Products Business Units.

Lead-free is defined as absence of a significant amount of lead (Chemical symbol Pb) in a package or part make-up. In an IC package, Pb is commonly found in the external lead finish or plating. In Chip Scale Packages (UCSP and FlipChip), Pb is found in the Solder Bumps.

Lead is a metal with no known biological benefit to humans. Too much lead can damage various systems of the body including the nervous and reproductive systems and the kidneys, and it can cause high blood pressure and anemia. Lead accumulates in the bones and lead poisoning may be diagnosed from a blue line around the gums. Lead is especially harmful to the developing brains of fetuses and young children and to pregnant women. Lead interferes with the metabolism of calcium and Vitamins D.