Primarily NEMI and IPC in the United States and Soldertec and Smartgroup in Europe. NEMI, which develops technology “roadmaps” for the electronics industry, identified a gap in the manufacturing infrastructure necessary for conversion to lead free in the early 1990’s when the first WEEE draft appeared. Since then NEMI has been instrumental in providing leadership and coordination to facilitate the conversion to lead-free.

Soldered surfaces must be free of lead to begin with. This includes the PCB as well as the component. Lead contamination on a lead-free solder joint will significantly reduce the reliability of the joint. All lead-free alloys melt at a higher temperature than traditional tin-lead alloys. The temperature of the soldering iron may need to be increased, and both the components and PCB will need to withstand these higher levels.

Higher melting point of Lead-free solder may cause physical and thermal damage to components and PCB.

You should always insist on getting your contract notes or purchase/sale note from your trading member What if the details contained in the contract/purchase/sale notes are incorrect or the notes include some You should countercheck the details contained in the contract/purchase/sale notes with those on the order and trade confirmation slip.

Since there is higher tin content, with higher temperature and presence of more active flux, the erosion of soldering tips occurs faster than regular tin/lead solder.

Altera does not have a set schedule to introduce lead-free solder bump flip-chip products at this time. Internal solder bumps are exempted from the RoHS Directive until 2010, and Altera is closely monitoring the industry progress with a plan to start qualification in the near future. Home | Products | Support | End Markets | Technology Center | Education & Events | Corporate | Buy On-Line

Reflow soldering: SnAgCu, SnAgCuBi, SnAg, SnAgBi, SnZnBi, SnIn (the bismuth-containing solders are more suitable for low temperature soldering) Wave Soldering: SnAgCu, SnCu, SnCu(Ni 0.1%), SnCuX, where X is the small fraction of elements claimed to increase performance A13. No suitable alternative has yet been identified for this solder which melts at around 302OC.

A31. Yes, but there is the potential for poor alignment and open joints. Since the usual SnPb reflow profile may not exceed the melting point of the BGAs’ lead-free solder balls, the SnPb solder paste melts but the SnAgCu solder balls do not. The lack of ball collapse may cause a lack of contact between the solder paste and the solder ball.

Click http://www.freescale.com/files/product/doc/ENV_MSLPPT.pdf to download the Freescale recommendation. Freescale targets a PPT of 260°C with an MSL of 3 or better, however, some products may not be able to meet this target. Freescale provides the PPT and MSL level for each part number via web access or by special request.

A: You should note that some alternative compounds have a higher melting point than the tin-lead compound. As such, a substantially higher re-flow temperature may be required for lead-free alternatives. Manufacturing equipment to handle material with these high temperatures, such as a multi-zone oven, is costly, and will require significant investment from your company or your contract manufacturer.

A18. Yes, for example, maintaining the composition of the solder bath, and advice should be sought from your solder and equipment suppliers. For example, the copper levels must be taken into account when replenishing the solder bath, and copper dissolution of the tracks and pads can result in their being less than the minimum acceptable thickness.

A29. There might be. If the component termination is lead-free, no compatibility issues would be expected with lead-free soldering. However, if the component termination does contain lead, the resulting lead concentration in the solder joint may be in the range 1-5wt%. If so, the there can be risks of poorer reliability. (NB. This is an area of keen research).

Aavid Thermalloy's RoHS policy is described in its RoHS specification, RoHS-9000. It generally sets the same limits for the six RoHS substances as currently specified by the EU legislation. It also bans asbestos and the use of ozone-depleting substances.

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We highly recommend Audio Note silver solder. This is one of the very few solders that has been specifically developed for audio use and is very highly rated.

Solder is a lead/tin mixture that is melted and used to bond two pieces of certain types of metal together.

If a customer requires that a package type not qualified as lead-free be manufactured and supplied, a request must be submitted to the Maxim Integrated Products Business Units.

While the science has repeatedly demonstrated that foods produced through biotechnology are as safe as conventional foods, approval of these foods in some overseas markets has been slow in coming. Despite their growing acceptance and history of safe use in the United States, certain countries-including the United Kingdom, France and other members of the European Union-have not yet approved these crops to be planted or purchased from another country.

Lead-free is defined as absence of a significant amount of lead (Chemical symbol Pb) in a package or part make-up. In an IC package, Pb is commonly found in the external lead finish or plating. In Chip Scale Packages (UCSP and FlipChip), Pb is found in the Solder Bumps.

Lead is a metal with no known biological benefit to humans. Too much lead can damage various systems of the body including the nervous and reproductive systems and the kidneys, and it can cause high blood pressure and anemia. Lead accumulates in the bones and lead poisoning may be diagnosed from a blue line around the gums. Lead is especially harmful to the developing brains of fetuses and young children and to pregnant women. Lead interferes with the metabolism of calcium and Vitamins D.