A31. Yes, but there is the potential for poor alignment and open joints. Since the usual SnPb reflow profile may not exceed the melting point of the BGAs’ lead-free solder balls, the SnPb solder paste melts but the SnAgCu solder balls do not. The lack of ball collapse may cause a lack of contact between the solder paste and the solder ball.

Reflow soldering: SnAgCu, SnAgCuBi, SnAg, SnAgBi, SnZnBi, SnIn (the bismuth-containing solders are more suitable for low temperature soldering) Wave Soldering: SnAgCu, SnCu, SnCu(Ni 0.1%), SnCuX, where X is the small fraction of elements claimed to increase performance A13. No suitable alternative has yet been identified for this solder which melts at around 302OC. See similar questions...

SnPb leadframe plating can be used with certain Pb-free solder pastes, as shown in the following table: Melting point 138°C; Not recommended –relatively weak joint strength when subject to temperature cycling; compatible with 100% matte tin finishes; not compatible with existing SnPb finishes Melting point 183°C; common use for electronic applications; compatible with 100% matte tin finishes; shiny appearance Melting point 219°C; compatible with existing SnPb finishes and 100% . See similar questions...

Higher melting point of Lead-free solder may cause physical and thermal damage to components and PCB. See similar questions...

All lead-free, RoHS-compliant products will have the (+) symbol marked on the top package in the area nearest Pin 1 lead, notch or dimple See similar questions...

Since there is higher tin content, with higher temperature and presence of more active flux, the erosion of soldering tips occurs faster than regular tin/lead solder. See similar questions...

Altera does not have a set schedule to introduce lead-free solder bump flip-chip products at this time. Internal solder bumps are exempted from the RoHS Directive until 2010, and Altera is closely monitoring the industry progress with a plan to start qualification in the near future. Home | Products | Support | End Markets | Technology Center | Education & Events | Corporate | Buy On-Line See similar questions...

Soldered surfaces must be free of lead to begin with. This includes the PCB as well as the component. Lead contamination on a lead-free solder joint will significantly reduce the reliability of the joint. All lead-free alloys melt at a higher temperature than traditional tin-lead alloys. The temperature of the soldering iron may need to be increased, and both the components and PCB will need to withstand these higher levels. See similar questions...

Primarily NEMI and IPC in the United States and Soldertec and Smartgroup in Europe. NEMI, which develops technology “roadmaps” for the electronics industry, identified a gap in the manufacturing infrastructure necessary for conversion to lead free in the early 1990’s when the first WEEE draft appeared. Since then NEMI has been instrumental in providing leadership and coordination to facilitate the conversion to lead-free. See similar questions...

Yes. The AC timing specifications on a PC133 device are tested to allow a system bus to run at 133 MHz. Majority of PC133 chips should work at PC100 and PC66. In fact, a -75 device is specified for PC100 timings using CAS latency = 2. Please refer manufacturer data sheet for AC timing table in the appropriate data sheet tCK at CL = 2. See similar questions...

Yes. The leads on new parts for the most part are coated with pure tin, which solders normally. Just make sure you buy some old-fashioned solder before IT goes away! See similar questions...

Allegro has selected 100% matte tin leadframe plating, a technology which has been widely demonstrated to be backwardly-compatible with existing SnPb-based processes. See similar questions...

A11. No, you will have to change your process to some degree. The choice is not necessarily straightforward, and will depend on the application, thermal and temperature factors, assembly technology, component thermal sensitivity, service life, volume, cost etc. However, there is an increasing consensus for using the SnAgCu family of alloys for many applications for both reflow and wave soldering. See similar questions...

Customers may continue to buy products that have not been "converted" subject to availability in either format, with SnPb Lead Finish or Lead Free. If other products are converted, advanced notification will be given. Should a major customer require product with SnPb plating after a general product conversion, a Customer Special Part Number may have to be generated. The length of time the old product will remain available to you will be by special agreement. (Pricing may then be reviewed. See similar questions...

Vertical adapter: The vertical adapters from an SFT can be used on an NXT. However, the vertical adapters on an NXT can't be used on an SFT (not without modification). Electronics: As long as the lower board is programmed for NXT beam-break eyes, it will work on a Shocker NXT. Boards not programmed for the eyes can't function unless there's a massive hardware modification (information for this coming soon). See similar questions...

Database technology is changing at a rapid pace. CONNX has a solid core on which the additional features and extensions are built. By ensuring our core architecture would fulfill our current requirement and future needs, we also reduced the time to market with these new features. Our new core architecture allows us to quickly add support for other databases and open access technologies. See similar questions...

Click http://www.freescale.com/files/product/doc/ENV_MSLPPT.pdf to download the Freescale recommendation. Freescale targets a PPT of 260°C with an MSL of 3 or better, however, some products may not be able to meet this target. Freescale provides the PPT and MSL level for each part number via web access or by special request. See similar questions...

Yes. Ultra ATA/66 hard drives are 100 percent backward compatible with both Ultra ATA/33 and DMA and with existing ATA hard drives, CD-ROM drives, and host systems. The Ultra ATA/66 protocol and commands are designed to be compatible with existing ATA devices and systems. Although a new 40-pin, 80-conductor cable is required for Ultra ATA/66, the system board chip set pin connector remains the same at 40. See similar questions...

It is the making of new software that can run on old computers. Instead of writing off old computers, most software companies decided to write software that could be used on older machines. Back to top See similar questions...

LVD is backward compatible through the single-ended interface if it is multimode LVD. It is doubtful that anyone will build LVD devices that are not multimode. Remember that connecting a single-ended device to a LVD/MSE bus will cause the entire bus to switch to the single-ended mode with its data throughput and cable length limitations. See similar questions...