National's lead-free leadframe-based surface mount packages are backward compatible. This means that leadframe-based components with matte tin finish can be attached to a PCB using tin/lead solder paste with a tin/lead solder profile (typical peak reflow temperatures ranging from 220?C to 235?C). This is not true for lead-free BGA or microSMD components, which are not compatible with the tin/lead solder process. National's lead-free LLP package has been shown to be backward compatible. See similar questions...

A31. Yes, but there is the potential for poor alignment and open joints. Since the usual SnPb reflow profile may not exceed the melting point of the BGAs’ lead-free solder balls, the SnPb solder paste melts but the SnAgCu solder balls do not. The lack of ball collapse may cause a lack of contact between the solder paste and the solder ball. See similar questions...

Reflow soldering: SnAgCu, SnAgCuBi, SnAg, SnAgBi, SnZnBi, SnIn (the bismuth-containing solders are more suitable for low temperature soldering) Wave Soldering: SnAgCu, SnCu, SnCu(Ni 0.1%), SnCuX, where X is the small fraction of elements claimed to increase performance A13. No suitable alternative has yet been identified for this solder which melts at around 302OC. See similar questions...

SnPb leadframe plating can be used with certain Pb-free solder pastes, as shown in the following table: Melting point 138°C; Not recommended –relatively weak joint strength when subject to temperature cycling; compatible with 100% matte tin finishes; not compatible with existing SnPb finishes Melting point 183°C; common use for electronic applications; compatible with 100% matte tin finishes; shiny appearance Melting point 219°C; compatible with existing SnPb finishes and 100% . See similar questions...

Lead free solder is not yet standardized world wide, however considering environment issue several evaluations are going on. Some details you can get at www.advancetech-info.com\lfta1.html See similar questions...

Higher melting point of Lead-free solder may cause physical and thermal damage to components and PCB. See similar questions...

Yes! The use of lead free solders is becoming more common every day. The primary concern regarding this trend is the effect that the higher tin content of many of the lead free solder alloys will have on current processes and tooling. The American Beauty® Solder Pot crucible is made of cast iron which does not readily dissolve into tin at temperatures below 800°F. See similar questions...

It depends on the part number. In the left hand margin of the catalog pages under specifications, you will find the processing information. Reflow processing will need a high temp body and matte tin finish. Samtec recommends through hole parts that have a high temp insulator be changed to matte tin as well. J-STD-020C refers to the moisture sensitivity of SMT electrical components. There is no relation or connection to the RoHS Directive. See similar questions...

All lead-free, RoHS-compliant products will have the (+) symbol marked on the top package in the area nearest Pin 1 lead, notch or dimple See similar questions...

Please contact National Semiconductor's local franchised distributor or Customer Support Center and specify "lead-free" or "Spec. NoPb" at the time of your order. Additional information can be obtained from your National Semiconductor sales representative. See similar questions...

Since there is higher tin content, with higher temperature and presence of more active flux, the erosion of soldering tips occurs faster than regular tin/lead solder. See similar questions...

Altera does not have a set schedule to introduce lead-free solder bump flip-chip products at this time. Internal solder bumps are exempted from the RoHS Directive until 2010, and Altera is closely monitoring the industry progress with a plan to start qualification in the near future. Home | Products | Support | End Markets | Technology Center | Education & Events | Corporate | Buy On-Line See similar questions...

Soldered surfaces must be free of lead to begin with. This includes the PCB as well as the component. Lead contamination on a lead-free solder joint will significantly reduce the reliability of the joint. All lead-free alloys melt at a higher temperature than traditional tin-lead alloys. The temperature of the soldering iron may need to be increased, and both the components and PCB will need to withstand these higher levels. See similar questions...

Primarily NEMI and IPC in the United States and Soldertec and Smartgroup in Europe. NEMI, which develops technology “roadmaps” for the electronics industry, identified a gap in the manufacturing infrastructure necessary for conversion to lead free in the early 1990’s when the first WEEE draft appeared. Since then NEMI has been instrumental in providing leadership and coordination to facilitate the conversion to lead-free. See similar questions...

Yes. The AC timing specifications on a PC133 device are tested to allow a system bus to run at 133 MHz. Majority of PC133 chips should work at PC100 and PC66. In fact, a -75 device is specified for PC100 timings using CAS latency = 2. Please refer manufacturer data sheet for AC timing table in the appropriate data sheet tCK at CL = 2. See similar questions...

Yes. The leads on new parts for the most part are coated with pure tin, which solders normally. Just make sure you buy some old-fashioned solder before IT goes away! See similar questions...

Allegro has selected 100% matte tin leadframe plating, a technology which has been widely demonstrated to be backwardly-compatible with existing SnPb-based processes. See similar questions...

A11. No, you will have to change your process to some degree. The choice is not necessarily straightforward, and will depend on the application, thermal and temperature factors, assembly technology, component thermal sensitivity, service life, volume, cost etc. However, there is an increasing consensus for using the SnAgCu family of alloys for many applications for both reflow and wave soldering. See similar questions...

Customers may continue to buy products that have not been "converted" subject to availability in either format, with SnPb Lead Finish or Lead Free. If other products are converted, advanced notification will be given. Should a major customer require product with SnPb plating after a general product conversion, a Customer Special Part Number may have to be generated. The length of time the old product will remain available to you will be by special agreement. (Pricing may then be reviewed. See similar questions...

a) Yes.  If the peak reflow temperature exceeds 240 degrees C, the MSL package rating may need to be downgraded. See similar questions...