Reflow soldering: SnAgCu, SnAgCuBi, SnAg, SnAgBi, SnZnBi, SnIn (the bismuth-containing solders are more suitable for low temperature soldering) Wave Soldering: SnAgCu, SnCu, SnCu(Ni 0.1%), SnCuX, where X is the small fraction of elements claimed to increase performance A13. No suitable alternative has yet been identified for this solder which melts at around 302OC.

A31. Yes, but there is the potential for poor alignment and open joints. Since the usual SnPb reflow profile may not exceed the melting point of the BGAs’ lead-free solder balls, the SnPb solder paste melts but the SnAgCu solder balls do not. The lack of ball collapse may cause a lack of contact between the solder paste and the solder ball.

A11. No, you will have to change your process to some degree. The choice is not necessarily straightforward, and will depend on the application, thermal and temperature factors, assembly technology, component thermal sensitivity, service life, volume, cost etc. However, there is an increasing consensus for using the SnAgCu family of alloys for many applications for both reflow and wave soldering.

SnPb leadframe plating can be used with certain Pb-free solder pastes, as shown in the following table: Melting point 138°C; Not recommended –relatively weak joint strength when subject to temperature cycling; compatible with 100% matte tin finishes; not compatible with existing SnPb finishes Melting point 183°C; common use for electronic applications; compatible with 100% matte tin finishes; shiny appearance Melting point 219°C; compatible with existing SnPb finishes and 100% .

Higher melting point of Lead-free solder may cause physical and thermal damage to components and PCB.

Since there is higher tin content, with higher temperature and presence of more active flux, the erosion of soldering tips occurs faster than regular tin/lead solder.

Altera does not have a set schedule to introduce lead-free solder bump flip-chip products at this time. Internal solder bumps are exempted from the RoHS Directive until 2010, and Altera is closely monitoring the industry progress with a plan to start qualification in the near future. Home | Products | Support | End Markets | Technology Center | Education & Events | Corporate | Buy On-Line

Soldered surfaces must be free of lead to begin with. This includes the PCB as well as the component. Lead contamination on a lead-free solder joint will significantly reduce the reliability of the joint. All lead-free alloys melt at a higher temperature than traditional tin-lead alloys. The temperature of the soldering iron may need to be increased, and both the components and PCB will need to withstand these higher levels.

Primarily NEMI and IPC in the United States and Soldertec and Smartgroup in Europe. NEMI, which develops technology “roadmaps” for the electronics industry, identified a gap in the manufacturing infrastructure necessary for conversion to lead free in the early 1990’s when the first WEEE draft appeared. Since then NEMI has been instrumental in providing leadership and coordination to facilitate the conversion to lead-free.

Allegro has selected 100% matte tin leadframe plating, a technology which has been widely demonstrated to be backwardly-compatible with existing SnPb-based processes.

Customers may continue to buy products that have not been "converted" subject to availability in either format, with SnPb Lead Finish or Lead Free. If other products are converted, advanced notification will be given. Should a major customer require product with SnPb plating after a general product conversion, a Customer Special Part Number may have to be generated. The length of time the old product will remain available to you will be by special agreement. (Pricing may then be reviewed.

Due to technology limitations, some package types are not currently qualified as lead-free. Examples: Ball Grid Array (BGAs) and Flip Chips. Maxim Integrated Products BGAs are eutectic and the majority of Maxim Integrated Products BGA packages are 63%Sn / 37%Pb. However, we do have some volume of 10mm Chip Scale Ball Grid Array (CSBGA) packages which are Sn/Ag/Cu and contain no lead.

A12: For the years 2000-2005, yes! These CDs are created by the kind folks at the Laboratory for High Energy Astrophysics at NASA's Goddard Space Flight Center. The free CDs can be ordered by sending mail to this address. Dr. James Lochner Imagine The Universe Mail Code 660 NASA/Goddard Space Flight Center Greenbelt, MD 20770 USA

Click http://www.freescale.com/files/product/doc/ENV_MSLPPT.pdf to download the Freescale recommendation. Freescale targets a PPT of 260°C with an MSL of 3 or better, however, some products may not be able to meet this target. Freescale provides the PPT and MSL level for each part number via web access or by special request.

We highly recommend Audio Note silver solder. This is one of the very few solders that has been specifically developed for audio use and is very highly rated.

Solder is a lead/tin mixture that is melted and used to bond two pieces of certain types of metal together.

If a customer requires that a package type not qualified as lead-free be manufactured and supplied, a request must be submitted to the Maxim Integrated Products Business Units.

The alternatives involve getting a joint ITD/CAEN account from the CAEN Office in the Media Union, which gives you access to the CAEN Sun Sparc 20s in NUBS and the Media Union Site, and the RS/6000 machines in the Media Union Site. It is also occassionally possible to get an account on a departmental unix machine, though not all departments have unix machines, and not all departments that do have unix machines offer accounts to all of their students, staff, and faculty.

Lead-free is defined as absence of a significant amount of lead (Chemical symbol Pb) in a package or part make-up. In an IC package, Pb is commonly found in the external lead finish or plating. In Chip Scale Packages (UCSP and FlipChip), Pb is found in the Solder Bumps.

Lead is a metal with no known biological benefit to humans. Too much lead can damage various systems of the body including the nervous and reproductive systems and the kidneys, and it can cause high blood pressure and anemia. Lead accumulates in the bones and lead poisoning may be diagnosed from a blue line around the gums. Lead is especially harmful to the developing brains of fetuses and young children and to pregnant women. Lead interferes with the metabolism of calcium and Vitamins D.